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Rogers RO4360 High Frequency PCB 24mil Double Sided RF Circuit Board With Immersion Gold for Ground-based Radar

Categories Rogers PCB Board
Brand Name: Bicheng
Model Number: BIC-117.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: Hydrocarbon Ceramic-filled Thermoset Materials
Layer count: Double Layer, Multilayer, Hybrid PCB
PCB thickness: 8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface finish: Bare copper, HASL, ENIG, OSP etc..
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Rogers RO4360 High Frequency PCB 24mil Double Sided RF Circuit Board With Immersion Gold for Ground-based Radar


Rogers RO4360 High Frequency PCB 24mil Double Sided RF Circuit Board With Immersion Gold for Ground-based Radar

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


RO4360G2 laminates of Rogers Corporation are 6.15 Dk, low loss, glass-reinforced, hydrocarbon ceramic-filled thermoset materials that provide the ideal balance of performance and processing ease. RO4360G2 laminates extend Rogers' portfolio of high performance materials by providing customers with a product that is lead-free process capable and offers better rigidity for improved processability in multi-layer board constructions, while reducing material and fabrication costs.


RO4360G2 laminates process similar to FR-4 and are automated assembly compatible. They have a low Z-axis CTE for design flexibility and have the same high Tg as all of the RO4000 product line. RO4360G2 laminates can be paired with RO4450F prepreg and lower-Dk RO4000 laminate in multi-layer designs.


RO4360G2 laminates, with a Dk of 6.15 (Design Dk 6.4), allow designers to reduce circuit dimensions in applications where size and cost are critical. They are the best value choice for engineers working on designs including power amplifiers, patch antennas, ground-based radar, and other general RF applications.


Features and benefits:

1. Thermoset resin system specially formulated to meet 6.15 Dk

1). Ease of fabrication / processes similar to FR-4

2). Material repeatability

3). Low loss

4). High thermal conductivity

5). Lower total PCB cost solution than competing PTFE products,


2. Low Z-axis CTE / High Tg

1). Design flexibility

2). Plated through-hole reliability

3). Automated assembly compatible


3. Environmentally friendly

1) Lead free process compatible


4. Regional finished goods inventory

1). Short lead times / quick inventory turns

2). Efficient supply chain


Some Typical Applications:

1. Base Station Power Amplifiers

2. Small Cell Transceivers

3. Patch antennas

4. Ground-based Radar



PCB Capability

PCB Material:Hydrocarbon Ceramic-filled Thermoset Materials
Designation:RO4360G2
Dielectric constant:6.15 ±0.15
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP etc..

Data Sheet of RO4360G2

RO4360G2 Typical Value
PropertyRO4360G2DirectionUnitsConditionTest Method
Dielectric Constant,εProcess6.15±0.15Z10 GHz/23℃IPC-TM-650 2.5.5.5
2.5 GHz/23℃
Dissipation Factor,tanδ0.0038Z10 GHz/23℃IPC-TM-650 2.5.5.5
Thermal Conductivity0.75W/mK50℃ASTM D-5470
Volume Resistivity4.0 X 1013Ω.cmElevated TIPC-TM-650 2.5.17.1
Surface Resistivity9.0 X 1012ΩElevated TIPC-TM-650 2.5.17.1
Electrical Strength784ZV/milIPC-TM-650 2.5.6.2
Tensile Strength131 (19) 97(14)X YMPa (kpsi)40 hrs 50%RH/23ASTM D638
Flexural Strength213(31) 145(21)X YMpa (kpsi)40 hrs 50%RH/23IPC-TM-650, 2.4.4
Coefficient of Thermal Expansion13 14 28X Y Zppm/℃-50 ℃to 288℃ After Replicated Heat CycleIPC-TM-650, 2.1.41
Tg>280℃ TMAIPC-TM-650 2.4.24.3
Td407ASTM D3850 using TGA
T288>30Zmin30 min / 125℃ PrebakeIPC-TM-650 2.2.24.1
Moisure Absorption0.08%50℃/48hrIPC-TM-650 2.6.2.1 ASTM D570
Thermal Coefficient of er-131 @10 GHzZppm/℃-50℃ to 150 ℃IPC-TM-650, 2.5.5.5
Density2.16gm/cm3RTASTM D792
Copper Peel Stength5.2 (0.91)pli (N/mm)Condtion BIPC-TM-650 2.4.8
FlammabilityV-0UL 94 File QMTS2. E102765


Cheap Rogers RO4360 High Frequency PCB 24mil Double Sided RF Circuit Board With Immersion Gold for Ground-based Radar for sale
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