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| Categories | Custom LED Displays |
|---|---|
| Brand Name: | KeRun |
| Model Number: | custom |
| Certification: | CE,ROHS,REACH |
| Place of Origin: | CHINA |
| MOQ: | Negotiable |
| Price: | Negotiable |
| Payment Terms: | T/T, Western Union, MoneyGram, L/C |
| Supply Ability: | 5000pcs/day |
| Delivery Time: | 22 working days |
| Packaging Details: | EPE+Carton |
| Name: | 4 Digits Custom Seven Segment LED Display Yellow Colour For Microphone |
| Product type: | Epoxy led display |
| Emitting color: | Yellow |
| Polarity: | Common cathode or anode |
| Panel Size: | 15*16mm |
| Display Function: | Digital display |
| Application: | For Microphone |
| Operating temprature: | -20°C-80°C |
| Life span: | 50000 hours |
| OEM&ODM service: | Welcome |
4 Digits Custom Seven Segment LED Display Yellow Colour For Microphone
Products Details:
| Parameter | Symbol | Maximum Rating | Unit |
| Power Dissipation | Pd | 47.5 | mW |
| Peak Forward Current | Ifp | 50 | mA |
| Continuous Forward Current) Forward )Current | Ifm | 25 | mA |
| Reverse Voltage | VR | 5 | V |
| Operating Temperature Range | Topr | -30→ +75 | ℃ |
| Storage Temperature Range | Tstg | -30 → +80 | ℃ |
| Static Voltage | Var | V | |
| Work life | Hour | 6~100000 | H |
Lead Sodering Temperature:260℃ for 3 seconds
For operation above 25℃, The Ifm Ifp & Pd must be derated, the Curent derating is –0.36mA/℃ for DC
drive and -0.86mA/℃ for Pulse drive, the power dissipation is -0.75mW/℃. The product working current
must not more than the 60% of the Ifm or Ifp according to the working temperature.
Optical-Electrical Characteristic
| Parameter | Test CONDITING | Symbol | Min | Type | Max | Unit |
| Luminous Intensity | IF=10mA | Iv | 45 | Mcd | ||
| Forward Voltage | IF=10mA | VF | 2.1 | V | ||
| REVERSE Current | VR= 5V | IR | - | - | 50 | uA |
| Peak Wavelength | IF=10mA | λp | 587 | nm | ||
| Spectral Bandwidth | IF=10mA | △λ | - | 5 | - | nm |

QC&QA
- Three times of inspection on all products on production:
Step 1: raw material check
Step 2: process check and full inspection after chip&wire bonding
Step 3: full test before packing and partial check before shipment

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